SKU: 75362047123
Ships within 48 hours · Estimated delivery Aug 29 - Sep 3
Remove dusts
As the pressure value increases
JC 13 In 1 Intel Qualcomm Logic Baseband EEPROM Chip Data Module Chip Non-removal Repair Tool For iPhone X-12 Pro Max eeprom baseband repair
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MECHANIC iBGA 13 Reballing Stencil Platform For iPhone 13 Pro Max Mini Option:iBGA 13 for iPhone 13 series Remove dustsMECHANIC iBGA 13 Middle Layer Motherboard Reballing Kit For iPhone 13 mini pro max Template Soldering Platform With Stencil, 4 in 1 BGA Reballing Stencil Platform Motherboard Middle Rework Tin Mesh Template for iPhone 13 13 Pro 13 Pro Max 12 mini. Features: 1. Anti leakage tin barrier design. 2. High temperature does not allow the drum. 3. Strong magnetic automatic positioning, precision positioning. 4. Integrated, removable tin planting. 5.
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